SCMD-WD

It is made of high grade and high strength diamond as raw material, on the basis of conventional diamond powder technology, by carrying out special treatment for the crystal shape and surface purification, particles have features of very clean surface, high toughness, consistent crystal shape, good thermal stability and wear resistance.

Through our unique technology of critical oversize elimination and length/width ratio control, the particles also have strictly concentrated PSD, and very high content of effective grinding grits. Besides, a variety of coated products are available, it greatly enhances the retention between diamond particles and the bond, thus to prolong the tool’s life and improve the sharpness. It also facilitates heat dissipation within the bond system resulting in longer service life of products.
Application: It is designed for producing diamond wire, and it is also widely used for cutting, grinding and polishing hard and brittle materials such as monocrystalline silicon, polycrystalline silicon, sapphire, quartz, semiconductor, liquid crystal glass, magnetic materials, etc.

Features:

√ Sharp and blocky particle shape
√ Extremely high purity (below 20PPM)
√ Concentrated particle size distribution
√ Good thermal stability, high wear resistance

Product Application:

Can be used to manufacture cutting tools such as diamond wire saws, gem saw blades, and semiconductor saw blades. Widely used for cutting, grinding, and polishing hard and brittle materials such as monocrystalline silicon, polycrystalline silicon, magnetic materials, sapphire, quartz, semiconductor, liquid crystal glass, and stone.

Available Size: