The applications of diamond micro powder in thermal conductive materials are mainly manifested in the following aspects:

• 1. Filled thermal conductive composite materials

(1). Enhancing thermal conductivity: Diamond has an extremely high thermal conductivity, which can reach up to 2,000 W/(m·K), much higher than common metal and non-metal materials. By adding diamond micron powder as a filler into polymer matrices (such as epoxy resin, silicone rubber, etc.), filled thermal conductive composite materials can be formed. When the filling amount of diamond micron powder reaches a certain level, the micron particles come into contact with each other to form a thermal conductive network, which can significantly increase the thermal conductivity coefficient of the material, endowing it with good thermal conductivity performance and making it applicable in fields such as heat dissipation of electronic equipment and thermal management of LED lighting.

Strengthening mechanical properties: The high hardness and high strength characteristics of diamond micron powder can, to a certain extent, enhance the mechanical properties of composite materials, such as improving the hardness, tensile strength, and wear resistance of the materials, which is extremely important for thermal conduction application scenarios with high requirements for material mechanical properties.

• 2. Thermal interface materials (TIM)

In electronic devices, the contact interfaces between different components have air gaps that can hinder the transfer of heat and lead to heat accumulation. Diamond micron powder can be added to thermal interface materials such as thermal conductive gaskets and thermal conductive pastes to fill the interface gaps, reduce the contact thermal resistance, and improve the heat transfer efficiency. Compared with traditional thermal conductive fillers (such as aluminum oxide, silicon nitride, etc.), diamond micron powder can provide higher thermal conductivity performance, thereby effectively conducting the heat generated by electronic components out and ensuring the normal operation and reliability of electronic devices.

• 3. Ceramic-based thermal conductive materials

Ceramic materials have good high-temperature resistance and insulation properties, but their thermal conductivity performance is relatively poor. By compounding diamond micropowder with ceramic materials, ceramic-based thermal conductive materials with high thermal conductivity performance can be prepared. For example, by adding diamond micropowder into materials such as alumina ceramics and aluminum nitride ceramics and optimizing the preparation process, the diamond micropowder can be uniformly dispersed in the ceramic matrix to form good thermal conductive channels and improve the thermal conductivity performance of the ceramic materials. Such ceramic-based thermal conductive materials can be used in the fields of heat dissipation of electronic equipment in high-temperature environments and packaging of power devices.

• 4. Printed circuit boards (PCB)

With the miniaturization, integration, and high-performance development of electronic equipment, the requirements for the heat dissipation performance of PCB are getting higher and higher. Diamond micron powder can be added as a filler into the substrate materials of PCB to prepare PCB substrates with thermal conductivity and insulation properties. This can not only ensure that the PCB has good thermal conductivity performance to quickly dissipate the heat generated by electronic components but also maintain the insulation performance of the substrate to prevent problems such as short circuits.